Ó²ººÊÓƵAPP

Manufacturing Services

Beyond wafer services

Leap from the starting line into a powerful finish when you partner with Ó²ººÊÓƵAPP

Every product starts from an idea, and you deserve a manufacturing partner that knows how to support you as you see it through. Ó²ººÊÓƵAPP Manufacturing Services is a network designed to seamlessly get you from chip design to wafer fabrication to final assembly and test. With the advantages of a global footprint and a leading reputation in semiconductor manufacturing and testing, Ó²ººÊÓƵAPP makes it easier for you to follow through on process so you can create the most effective product for your customers. Wherever your idea is headed, let Ó²ººÊÓƵAPP help you get it to the finish line.

25+ years of

experience

RF testing

leadership

Global manufacturing

footprint across the

U.S., Europe & Asia

Top partners all over the world

Located worldwide, Ó²ººÊÓƵAPP¡¯s OSAT partners have been vetted and approved by Ó²ººÊÓƵAPP so our customers can be confident in their products, from beginning to end.

  • Gigasolutions
  • Amkor
  • ASE
  • POWERTech Inc.
  • Matek

A world-class test solutions provider  

A leader in complex testing, Ó²ººÊÓƵAPP has developed over 600 test solutions that provide customers with the reliability assurance they need at every stage of production.  

  • Extensive RF testing solutions
  • High and low temperature test capabilities
  • Analog and digital TxRx testing
  • Memory testing including eNVM
  • High speed interface test capabilities
  • High voltage and high current testing 
  • ATE test programs

Wafer services

As a part of a full turnkey offering, Ó²ººÊÓƵAPP offers Bump, Wafer Level Package and Probe capabilities, complemented by OSAT partnerships, to provide a one-stop-shop for customers¡¯ wafer needs. Creating a reliable and high-quality path to production, Ó²ººÊÓƵAPP streamlines manufacturing so customers can realize their designs quicker.

  • Bump offerings for 200mm and 300mm, including SnAg bump, copper pillar and WLCSP
  • Wafer sort with Known-Good-Die methodology
  • Backside grind, wafer sort and bake, dicing, marking and binning services available

Module services

Comprehensive, reliable and supported by OSAT partners, Ó²ººÊÓƵAPP¡¯s Module services convert the manufactured wafer into a customized product with flexible packaging options.

  • Industry standard packaging including scan bake tape
  • Package and assembly capability complemented by Ó²ººÊÓƵAPP trusted OSAT partners
  • Test offerings: Complex RF tests, burn-in testing for early signs of failure and module final testing for pre-board certainty

Engineering services

From design to product packaging and testing needs, Ó²ººÊÓƵAPP¡¯s engineering services go beyond standard manufacturing practices to deliver the solutions that enable unique ideas to become reality. For questions of design feasibility, connectivity enablement and package resilience, Ó²ººÊÓƵAPP has the experience and partnerships to address the specific questions customers need answered.

  • Work with Ó²ººÊÓƵAPP partners to perfect your design for manufacturing with Ó²ººÊÓƵAPP¡¯s design services
  • Package engineering services, including electrical analysis, thermal analysis and mechanical analysis
  • Wide range of reliability stress services to meet client qualification needs consistent with JEDEC, Mil-std and AEC specifications
  • Engineering and debugging services available for all Ó²ººÊÓƵAPP tests in production, including customer written test programs
  • Test offerings: Choose from a range of test solutions including extensive state-of-the-art RF, analog and digital testing solutions backed by 22 years of high frequency mmWave test experience